- Josephine Melia
- Stressed Ni films electroplating for controlled spalling technology
- Physics
Describe
your research
experience
My project is to produce stressed Ni films by electroplating for controlled spalling technology application.
There are several methods of fabricating thin films to fulfill the demand in thinner electronics. We are interested in a newer method called Controlled Spalling Technology (CST). CST consists of two layers: substrate and stressor. Stressor requires a large intrinsic stress to initiate the process. We are using Nickel (Ni) for the material of the stressor layer because it has high fracture toughness. Electroplating is used to deposit this stressor layer on the desired substrate. Then we characterize the stressor to measure its intrinsic stress and to know whether it is possible to apply CST.
As one of the recipient's of OUR's Research Support Grant (2016), the results of Josephine's research can be found here.
