When science, art, and nature collide, a happy accident can come to fruition. Meet Flik, a copper “insect” named after a beloved animated ant from my childhood. In this scanning electron microscopy (SEM) image, Flik takes center stage, flaunting intricate corncob-like structures. These structures were formed by electroplating, a process whereby an applied voltage drives copper ions to deposit onto a surface, creating coatings with adjustable structure, thickness, and porosity. In theory, this technique could have produced an advanced heat spreader for electronics or a highly efficient boiling surface. But experiments don’t always go as planned. Imperfect preparation led to an uneven distribution of copper nucleation sites, and instead of an optimized boiling surface, Flik was born—a beautiful, unexpected reminder to celebrate the unintended artistry and lessons in failure.